HEAT CONDUCTIVE PASTE

PURPOSE:

The development is designed to remove heat from the heat-generating working elements of electronic devices, in particular processors, chipsets, computer video accelerators, etc.

DESCRIPTION:

The use of ZnO nanoparticles in the manufacture of thermal paste instead of ZnO micro powder leads to an increase in the value of its thermal conductivity coefficient from 0.8 to 2.5 W / (m * K).

ADVANTAGES:

Improvement of heat removal from the heat-generating working elements of electronic devices is achieved due to the realized three times high thermal conductivity coefficient in comparison with the existing analogue – paste KPT-8.

RECOMMENDED FIELD OF APPLICATION:

The development will be in demand in electrical engineering.

RESULTS OF THE RESEARCH:

Ready for implementation.

STAGE OF THE DEVELOPMENT READINESS:

Working documentation developed.

TRANSFER OPPORTUNITY:

Collaborative industrialization.

NOVELTY:

1 patent of Ukraine.

 

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